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Showing 6 results for Electrodeposition

Saremi M., Motaghi Golshan B.,
Volume 3, Issue 3 (12-2006)
Abstract

A film of osteoconductive and biocompatible material on biomedical metallic implants can create bioactivity of the implant and shorten healing time. Hydroxyapatite, that is the most important mineral part of human bone, was coated on Ti6Al4V using cathodic electrode position process. Pulse electrode position technique was used and the effects of different parameters such as potential, duty cycle (on time/ (on time+ off time)), temperature and current density on the morphology of the deposits were examined. Nano size deposits were formed under controlled temperature and optimization of voltage and current density.
Z. Ghaferi, K. Raeissi, M. A. Golozar,, A. Saatchi, S. Kabi,
Volume 7, Issue 4 (10-2010)
Abstract

Abstract:

current densities. Electrochemical impedance spectroscopy (EIS) results showed that the codeposition mechanism of

tungsten in Ni-W deposition is the reduction of tungsten oxide which changed to the reduction of tungsten-containing

ion complexes at higher current densities. In Co-W electrodeposition, the tungsten codeposition takes place via

reduction of tungsten oxide, although, the role of tungsten-containing complexes at higher current densities cannot be

ruled out. The surface morphology of Ni-W coatings was crack-free and was strongly dependent on deposition current

density. In addition, higher grain size and lower tungsten content were obtained by increasing the current density. In

Co-W coatings, no obvious variation in surface morphology was observed except for the fine cracks appeared at

higher current densities. In this system the grain size remained almost constant with increasing current density. The

microhardness values of Ni-W and Co-W coatings decreased due to the increase in the grain size and/or decrease in

tungsten content.

Ni-W and Co-W alloy nanocrystalline coatings were electrodeposited on copper substrate at different

M. R. Zamanzad-Ghavidel,, K. Raeissi, A. Saatchi,
Volume 9, Issue 2 (6-2012)
Abstract

Abstract: Nickel was electrodeposited onto copper substrates with high {111} and {400} peak intensities. The grain size of coatings deposited onto the copper substrate with a higher {111} peak intensity was finer. Spheroidized pyramid morphology was obtained at low current densities on both copper substrates. By increasing the deposition current density, grain size of the coating was increased for both substrates and eventually a mixed morphology of pyramids and blocks was appeared without further increase in grain size. This decreased the anodic exchange current density probably due to the decrease of surface roughness and led to a lower corrosion rate.
S. Akbarzadeh, S.r. Allahkaram, S. Mahdavi,
Volume 15, Issue 2 (6-2018)
Abstract

Tin-Zinc alloy coatings have many applications because of their unique properties such as corrosion resistance, solderability and flexibility. In this study, the effect of current density, temperature and pH on chemical composition, cathodic current efficiency, morphology and structures of the coatings was investigated. The results illustrated that, at low current densities (<0.5 mA/cm2), the coatings were relatively pure tin, but Zn content increased with enhancing the current density. At higher currents a relatively pure Zn film was obtained. Temperature and pH also affected chemical composition of the alloy films. Zn content of the coatings was decreased by increasing the temperature, while its variation with pH had ascending-descending trend. Morphological investigation of the coatings revealed that increasing Zn content of deposits led to porous, rough and fine grained films.


Hadi Sharifidarabad, Alireza Zakeri, Mandana Adeli,
Volume 21, Issue 0 (3-2024)
Abstract

The sensitivity of lead dioxide coating properties to the deposition conditions and electrolyte composition has allowed the preparation of coatings with different properties for different applications. In this study, the effects of electrolyte additives on the electrodeposition process were investigated using electrochemical measurements such as cyclic voltammetry, chronoamperometry and electrochemical impedance spectroscopy. The results showed that the presence of fluoride ions significantly reduce the possibility of TiO2 formation. The addition of copper ions not only prevents lead loss at the cathode, but also leads to the formation of copper oxide on the surface at initial stages, which hinders nucleation of PbO2. The presence of sodium dodecyl sulfate (SDS) also interferes with the nucleation process as it occupies active nucleation sites. The α-PbO2 interlayer prevents copper oxidation and solves the problem of lead dioxide nucleation. Finally, it was found that the simultaneous use of all additives together with the α-PbO2 interlayer has a positive effect on the coating process.
Dipali Potdar, Sushant Patil, Yugen Kulkarni, Niketa Pawar, Shivaji Sadale, Prashant Chikode,
Volume 21, Issue 1 (3-2024)
Abstract

The Nickel tungsten (Ni-W) alloy was electrodeposited on stainless steel (SS) substrate using potentiostatic mode at room temperature. Potentiostatic electrodeposition was carried out by varying the deposition time. The physicochemical properties of Ni-W alloys were studied using X-Ray diffraction (XRD), Electron Microscopy and micro-Raman spectroscopy. Recorded XRD spectra was compared with standard JCPDS card and the presence of Ni was confirmed, no such peaks for W were observed. Further study was extended for micro-Raman analysis. From Raman spectroscopy study the appearance of Ni-O and W6+=O bonds confirms that the Ni-W present in amorphous phase. Several cracks were observed in SEM images along with nanoparticles distributed over the electrode surface. The appearance of cracks may be correlated with the in-plane tensile stresses, lattice strains and stacking faults and may be related to the substrate confinements.
 

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