<?xml version="1.0" encoding="utf-8"?>
<journal>
<title>Iranian Journal of Materials Science and Engineering</title>
<title_fa>فصلنامه علم و مهندسی مواد ایران</title_fa>
<short_title>IJMSE</short_title>
<subject>Engineering &amp; Technology</subject>
<web_url>http://ijmse.iust.ac.ir</web_url>
<journal_hbi_system_id>18</journal_hbi_system_id>
<journal_hbi_system_user>agent2</journal_hbi_system_user>
<journal_id_issn>1735-0808</journal_id_issn>
<journal_id_issn_online>2383-3882</journal_id_issn_online>
<journal_id_pii></journal_id_pii>
<journal_id_doi></journal_id_doi>
<journal_id_iranmedex></journal_id_iranmedex>
<journal_id_magiran></journal_id_magiran>
<journal_id_sid></journal_id_sid>
<journal_id_nlai></journal_id_nlai>
<journal_id_science></journal_id_science>
<language>en</language>
<pubdate>
	<type>jalali</type>
	<year>1402</year>
	<month>6</month>
	<day>1</day>
</pubdate>
<pubdate>
	<type>gregorian</type>
	<year>2023</year>
	<month>9</month>
	<day>1</day>
</pubdate>
<volume>20</volume>
<number>3</number>
<publish_type>online</publish_type>
<publish_edition>1</publish_edition>
<article_type>fulltext</article_type>
<articleset>
	<article>


	<language>en</language>
	<article_id_doi></article_id_doi>
	<title_fa></title_fa>
	<title>The Formation of Red Copper Glaze in an Oxidizing Atmosphere</title>
	<subject_fa></subject_fa>
	<subject></subject>
	<content_type_fa>Research Paper</content_type_fa>
	<content_type>Research Paper</content_type>
	<abstract_fa></abstract_fa>
	<abstract>&lt;div style=&quot;text-align: justify;&quot;&gt;&lt;span style=&quot;font-size:14pt&quot;&gt;&lt;span style=&quot;line-height:200%&quot;&gt;&lt;span new=&quot;&quot; roman=&quot;&quot; style=&quot;font-family:&quot; times=&quot;&quot;&gt;&lt;span lang=&quot;EN-US&quot; style=&quot;font-size:12.0pt&quot;&gt;&lt;span style=&quot;line-height:200%&quot;&gt;This paper introduces a method for producing red copper glaze by adding copper oxide (CuO) and silicon carbide (SiC) additives to the base glaze.&lt;span style=&quot;background-color:#ffffff;&quot;&gt; &lt;/span&gt;&lt;span style=&quot;background:yellow&quot;&gt;&lt;span style=&quot;background-color:#ffffff;&quot;&gt;SiC created a reducing environment in situ and allowed the glaze to be sintered in an oxidizing furnace environment. Nanocrystals are the determinants of the red color of the glaze. The CuO reduction reaction temperature range of SiC produces a reducing environment in the glaze as detected by the method (DSC). The functional group and phase of nanocrystals were determined by Fourier transform infrared (FT-IR) and X-ray diffraction (XRD) spectroscopy.&lt;/span&gt;&lt;/span&gt;&lt;span style=&quot;background-color:#ffffff;&quot;&gt;&amp;nbsp;&lt;/span&gt; &lt;/span&gt;&lt;/span&gt;&lt;/span&gt;&lt;/span&gt;&lt;/span&gt;&lt;/div&gt;</abstract>
	<keyword_fa></keyword_fa>
	<keyword>CuO,SiC,nanocrystal,in situ reducing agent</keyword>
	<start_page>1</start_page>
	<end_page>9</end_page>
	<web_url>http://ijmse.iust.ac.ir/browse.php?a_code=A-10-4833-1&amp;slc_lang=en&amp;sid=1</web_url>


<author_list>
	<author>
	<first_name>Nguyen Vu Uyen</first_name>
	<middle_name></middle_name>
	<last_name>Nhi</last_name>
	<suffix></suffix>
	<first_name_fa></first_name_fa>
	<middle_name_fa></middle_name_fa>
	<last_name_fa></last_name_fa>
	<suffix_fa></suffix_fa>
	<email>nvunhi@hcmut.edu.vn</email>
	<code>1800319475328460017305</code>
	<orcid>1800319475328460017305</orcid>
	<coreauthor>No</coreauthor>
	<affiliation>Ho Chi Minh City University of Technology (HCMUT)</affiliation>
	<affiliation_fa></affiliation_fa>
	 </author>


	<author>
	<first_name>Doan Duong Xuan</first_name>
	<middle_name></middle_name>
	<last_name>Thuy</last_name>
	<suffix></suffix>
	<first_name_fa></first_name_fa>
	<middle_name_fa></middle_name_fa>
	<last_name_fa></last_name_fa>
	<suffix_fa></suffix_fa>
	<email>thuy.doanbachkhoa@hcmut.edu.vn</email>
	<code>1800319475328460017306</code>
	<orcid>1800319475328460017306</orcid>
	<coreauthor>No</coreauthor>
	<affiliation>Ho Chi Minh City University of Technology (HCMUT)</affiliation>
	<affiliation_fa></affiliation_fa>
	 </author>


	<author>
	<first_name>Do Quang</first_name>
	<middle_name></middle_name>
	<last_name>Minh</last_name>
	<suffix></suffix>
	<first_name_fa></first_name_fa>
	<middle_name_fa></middle_name_fa>
	<last_name_fa></last_name_fa>
	<suffix_fa></suffix_fa>
	<email>mnh_doquang@hcmut.edu.vn</email>
	<code>1800319475328460017307</code>
	<orcid>1800319475328460017307</orcid>
	<coreauthor>No</coreauthor>
	<affiliation>Ho Chi Minh City University of Technology (HCMUT)</affiliation>
	<affiliation_fa></affiliation_fa>
	 </author>


	<author>
	<first_name>Kieu Do Trung</first_name>
	<middle_name></middle_name>
	<last_name>Kien</last_name>
	<suffix></suffix>
	<first_name_fa></first_name_fa>
	<middle_name_fa></middle_name_fa>
	<last_name_fa></last_name_fa>
	<suffix_fa></suffix_fa>
	<email>kieudotrungkien@hcmut.edu.vn</email>
	<code>1800319475328460017308</code>
	<orcid>1800319475328460017308</orcid>
	<coreauthor>Yes
</coreauthor>
	<affiliation>Ho Chi Minh City University of Technology (HCMUT),</affiliation>
	<affiliation_fa></affiliation_fa>
	 </author>


</author_list>


	</article>
</articleset>
</journal>
